High Productivity Combinatorial Analysis of Cu Post-CMP Cleans: Corrosion Protection and Queue Time

摘要：

High Productivity Combinatorial (HPC) technology was used to evaluate post-CMP clean chemistries and their impact on copper surface corrosion protection and queue time performance. Cleaning formulations at low pH and high pH, both with and without functional additives, were used to produce a wide range of surface conditions in semiconductor processing.

作者: Jeff Barnes Jun Liu Steve Medd Cuong Tran David Yin Peng Zhang

作者单位: ATMI, Inc., 7 Commerce Drive, Danbury, Connecticut 06810, USA

会议类型: 国际会议

会议名称: China Semiconductor Technology International Conference 2010(中国国际半导体技术大会 CSTIC)

会议地点: 上海

会议语种:英文

页码: 613-618

在线出版日期: 2010-03-18（万方平台首次上网日期，不代表论文的发表时间）