The Pad Dressing Phenomena of Multiple Diamond Grits: Implications for The Design of CMP Pad Conditioners
Diamond disks are indispensable for dressing CMP pads. However, due to the poor leveling of diamond tips, only a few percents of diamond grits can penetrate the pad. As these few crystals are worn out, the plastic deformation of the pad becomes large relative to the amount of pad is cut. The polishing rate will then decline; and the scratch rate, increase. A novel technique has been developed to identify the cutting tips and their dulling process. The cutting paths become widen and shallow with more and more deformed pad material. Eventually, fewer and fewer scratch lines are present with most touching diamond pushing deformed pad around. Because there are only a handful of diamond grits that are engaged in cutting pad, the number of working crystals can increased substantially by improving the leveling of diamond tips. This improvement can increase the longevity of diamond disks that paves the way for future CMP of 18 inches wafers scheduled to make the debut in 2012.
James C. Sung Na-Lin Chen Yang-Liang Pai Cheng-Shiang Chou Chih-Chung Chou Shao-Chung Hu Michael Sung
KINIK Company, Taipei, Taiwan National Taiwan University, Taipei, Taiwan National Taipei University KINIK Company, Taipei, Taiwan Advanced Diamond Solutions, San Francisco, U.S.A. SinoDiamond, Haian, Jiangsu, China
国际会议
China Semiconductor Technology International Conference 2010(中国国际半导体技术大会 CSTIC)
上海
英文
639-644
2010-03-18（万方平台首次上网日期，不代表论文的发表时间）