Application of chemical mechanical polishing in the infrared focal plane arrays manufacturing process
Chemical mechanical polishing (CMP) is a powerful method for manufacturing the infrared focal plane arrays structure. In order to achieve planarizing surface and high polishing rate, the slurry prescription and polishing techniques for infrared focal plane arrays are studied, which is based on the low mechanical and high chemical polishing process, and the new point is put forward. The ingredient and prescription of slurry is found, in which the smaller size (ranging from 15 to 20 nm) silica sols is chosen as abrasive. The slurry with smaller abrasive and polishing technology effectively reduces the roughness and thickness of the damaged layer resulting from abrasion. After more research, the main ingredients, including oxidizer, complexing agent (organic-alkali hydroxide multi-amine) and surfactant are chosen preferentially.
Xiaoyan Liu Yuling Liu Zhiwen Zhao Yi Hu Baohong Gao Juan Wang
Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China
国际会议
China Semiconductor Technology International Conference 2010(中国国际半导体技术大会 CSTIC)
上海
英文
655-659
2010-03-18（万方平台首次上网日期，不代表论文的发表时间）