Effect of Plating and Anneal Processes on Properties of Electroplated Copper Films
Electroplated copper film has been used extensively in large scale integrated circuits as a conducting metal for interconnect. Therefore, the investigation on the correlations between film properties and process parameters is of great significance. This paper describes the effect of various plating parameters, including plating current, thickness of plated film, wafer rotation speed, and anneal process on the properties of electroplated copper films. The properties investigated include stress, reflectance, sheet resistance, roughness, and grain size of electroplated copper conductive layers.
Sheng Liu Ruipeng Yang Jiaxiang Nie Weiye He Xiangtao Kong Yun Kang
Logic Technology Development Center, Semiconductor Manufacturing International Corporation, No.18 Zhang Jiang Rd., Shanghai, 201203, P.R.China
国际会议
China Semiconductor Technology International Conference 2010(中国国际半导体技术大会 CSTIC)
上海
英文
793-798
2010-03-18（万方平台首次上网日期，不代表论文的发表时间）