Bond Ball Size Optimization on UCP Die of Chip Card Module
Wire bonding damage on die shield was detected on UCP (inline pads) die, and the root cause was the bonded ball touch the die shield due to big ball size which already out of bond pad area. In order to resolve this problem, a feasibility study on free air ball (FAB) size & 1st bond ball size with 24um diameter of Au wire and indentified capillary had been carried out at wire bonder ESEC 3006 and ESEC 3088. Therefore two DOES were performed, first was the FAB size as response of EFOs current and time as factors. Second was bond force and power (ultrasonic) as factors while 1st bonds ball shear test, ball height, ball size (diameter), percentage of intermetallic (IMC) and cratering were responses. Nevertheless 2nd bond performance was also taken into assessment namely non stick on lead and lifted stitch. Reliability tests temperature cycling and temperature humidity test were performed to prove the robustness of this smaller ball diameter. Overall, experimental results revealed that the die shield damage could be resolved & prevented by smaller bond ball.
Shen Juan Shan Kang ping
Infineon Technologies (Wuxi) Co. Ltd. CC Operations, Process Engineering Infineon Technologies (Wuxi) Co. Ltd. CC Operations, Equipment Engineering
国际会议
China Semiconductor Technology International Conference 2010(中国国际半导体技术大会 CSTIC)
上海
英文
883-889
2010-03-18（万方平台首次上网日期，不代表论文的发表时间）