An Overview of Current Research on Simultaneous Double Side Grinding of Silicon Wafers

摘要：

Simultaneous double side grinding (SDSG) is one of the state-ofart processes to flatten silicon wafers. This paper presents an overview of current research on SDSG of silicon wafers, which includes process applications, process modeling, and possible topics for future research.

作者: Bin Lin Z.C. Li Wangping Sun X. H. Zhang

作者单位: Mechanical Engineering College, Tianjin University, Tianjin 300072, China Department of Industrial & Systems Engineering, North Carolina Agricultural & Technical State Univer Department of Manufacturing & Mechanical Engineering Technology, Oregon Institute of Technology, Kla Seagate Technology, Minneapolis, Minnesota 55435, USA

会议类型: 国际会议

会议名称: China Semiconductor Technology International Conference 2010(中国国际半导体技术大会 CSTIC)

会议地点: 上海

会议语种:英文

页码: 1087-1092

在线出版日期: 2010-03-18（万方平台首次上网日期，不代表论文的发表时间）