Vacuum Micro-electroforming Technique for the Production of Void-free Microcomponent

摘要：

Pinhole defect in the deposit is one of the ticklers which have not yet been solved fundamentally when micro-electroforming nickeI into high-aspect-ratio(HAR) micro-molds．To obtain void-free micro-components，a new microelectroforming technique，which was carried out under the complex circumstance of vacuum．degassing and temperature．gradient．was developed in this paper．Mechanisms of this micro．electroforming process were introduced using graphic and simulation methods．To investigate the feasibility of the exploited technique，a series of experiments were performed using special equipment developed by authors，followed by the evaluating of surface morphology ofnickel micro-electroforms using a scanning electron microscope(SEM)．Experimental results showed that，comparing with the conventional electroforming practices，a significant reduction in pinhole defects ofthe samples electroformed by the hovel process was achieved．

关键词： Micro-electroforming Vacuum-degassing Void free Microcomponent

作者: P.M.Ming D.Zhu F.Zhou Y.Y.Hu

作者单位: Jiangsu Key Laboratory of Precision and Micro-manufacturing Technology,Nanjing University of Aeronau Jiangsu Key Laboratory of Precision and Micro-manufacturing Technology,Nanjing University of Aeronau

会议类型: 国际会议

会议名称: The 3rd Conference of Cross-Strait Engineering Education and Ceeusro & 1st International Conference on Engineering Technologies and Ceeusro(ICETC2009)(第三届工程技术与产学研研讨会暨第一届国际功能制造技术学术会议)

会议地点: 常州

会议语种:英文

页码: 142-146

在线出版日期: 2009-11-19（万方平台首次上网日期，不代表论文的发表时间）