Computer simulation on the motion tracks of Ice Fixed Abrasives Polishing
Ice fixed abrasives (IFA) polishing is a novel ultraprecision machining method. The motion tracks of abrasives during 1FA polishing have an important effect on the quality of the machined silicon wafer. Firstly, the motion tracks of IFA polishing are theoretically analyzed in this paper. It is founded that the paths of any point in the IFA polishing pad relative to the wokpiece are a group of cycloids. Then, the motion tracks of single abrasive and multiple abrasives in the IFA polishing pad are simulated respectively. The results show that increasing the eccentricity is beneficial to the enlargement of the size range of polishing process. With the increasing of the speed ratio between the IFA polishing pad and the workpiece, the abrasive at higher speed can leave longer tracks on the workpiece than that at lower speed at the same time. The more the abrasives, the more uniform the mark density under the influence of more abrasives.
Ice Fixed Abrasives Polishing Single silicon wafer Motion track
Y.L.Sun D.W.Zuo J.Li W.Z.LU Z.Z.Yu
College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing,China,210016
国际会议
常州
英文
376-380
2009-11-19（万方平台首次上网日期，不代表论文的发表时间）