Stress in Freestanding CVD Diamond Thick Film

摘要：

The present paper describes research on stress in freestanding diamond thick film, diameter of 60mm, prepared on Mo substrate by DC arc plasma jet chemical vapor deposition (DCPCVD) method. The stress in the CVD diamond film was investigated by X-ray diffraction and Raman spectrum. The results show that the stress in the film is compressive. The stress changes little at the same homocentric round. The compressive stress along radial direction is that the stress in the centre of the film is lower than that in the edge at both the final surface and the original surface.

关键词： Diamond Film Stress Large Area Freestanding

作者: W.Z.Lu J.J.Yuan D.W.Zuo F.Xu Y.L.Sun

作者单位: College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing,210016,China

会议类型: 国际会议

会议名称: The 3rd Conference of Cross-Strait Engineering Education and Ceeusro & 1st International Conference on Engineering Technologies and Ceeusro(ICETC2009)(第三届工程技术与产学研研讨会暨第一届国际功能制造技术学术会议)

会议地点: 常州

会议语种:英文

页码: 564-567

在线出版日期: 2009-11-19（万方平台首次上网日期，不代表论文的发表时间）