Analysis and Modifying of Injection-Mold for Notebook Computer Housing by CAE

摘要：

In the paper, C-Mold software was applied to the analysis of injecting molding of the notebook computer housing so as to solve the main problems of warpage and injection unbalance of the product. According to the results of filling analysis, the problem has been found out and the mold design has been improved. The described case showed the capability of CAE to find the reasons that cause warpage, duration of cooling period, sink mark, blush, color variation and shrinkage directly or indirectly. Thus, CAE analysis has a wide application prospects in injection molding.

关键词： CAE injection molding notebook computer housing

作者: B.Liu X.J.Liu L.Liao Y.B.Du

作者单位: Shenzhen Institute of Information Technology,Shenzhen,518029,China

会议类型: 国际会议

会议名称: The 3rd Conference of Cross-Strait Engineering Education and Ceeusro & 1st International Conference on Engineering Technologies and Ceeusro(ICETC2009)(第三届工程技术与产学研研讨会暨第一届国际功能制造技术学术会议)

会议地点: 常州

会议语种:英文

页码: 568-571

在线出版日期: 2009-11-19（万方平台首次上网日期，不代表论文的发表时间）