Low Cost Camera Modules Using Integration of Wafer-Scale Optics and Wafer-Level Packaging of Image Sensors

摘要：

Using wafer scale optics, wafer scale integration, and wafer level packaging of image sensor, we developed small form factor (3.3mm×3.3mm×2.4mm), low manufacturing cost, Pb-free solder reflow compatible digital camera modules which are suitable for many applications including mobile electronic devices, automotives, security, and medical applications.

作者: Hongtao Han Keith Main

作者单位: Tessera, 9815 David Taylor Drive, Charlotte, NC 28262, USA

会议类型: 国际会议

会议名称: ACP2009亚太光纤通信与光电国际会议

会议地点: 上海

会议语种:英文

页码: 1-2

在线出版日期: 2009-11-01（万方平台首次上网日期，不代表论文的发表时间）