Photonic Interconnects for Computer Applications

摘要：

For intra-rack board-to-board and intra-board interconnections, photonics can enable system topologies no longer feasible with copper. One interesting application of photonics is to realize a high speed multidrop bus. Historically, computer system architectures were dominated by multidrop bus designs. However, signal integrity constraints on high speed electronic buses have forced system designers to abandon conventional bus architectures replacing them with networked point-to-point connections. In this paper, we present the design and construction of a 30cm long, 4 channel optical multidrop bus capable of interconnecting up to 8 receiver modules at 10Gbps per channel.

作者: Michael R. T. Tan Huei Pei Kuo Paul Rosenberg Sagi Mathai Joseph Straznicky Lennie Kiyama Jong S. Yeo Moray Mclaren Wayne Mack Plary Mendoza

作者单位: Hewlett Packard Labs

会议类型: 国际会议

会议名称: ACP2009亚太光纤通信与光电国际会议

会议地点: 上海

会议语种:英文

页码: 1-2

在线出版日期: 2009-11-01（万方平台首次上网日期，不代表论文的发表时间）