Preparation of Ultra-Fine Copper Powder and Its Application in Manufacturing Conductive Lines by Printed Electronics Technology

摘要：

Ultra-fine copper powder was prepared by ball milling solid phase reaction in ambient condition. Ctystallinity of the synthesized copper powder was investigated using an X-ray diffraction, while the morphology of the copper particles was studied via scanning electron microscopy. The energy dispersive spectroscopy peaks and the analysis of resultant particles’ components were also presented. The resultant particles were protected from oxidation by atmospheric air, by the use of benzotriazole. Face-centered cubic copper particles with about 200 nm in diameter were obtained. The resultant powder was impurity-free and shows good stability.

关键词： conductive inks ultra-fine copper powder printed electronics technology conductive lines ball milling reaction

作者: Ying Yang Shouxu Wang Wei He Ke Hu Bo He Yunqi Mo

作者单位: School of Microelectronics and Solid-State Electronics University of Electronic Science and Technolo Zhuhai Topsun Electric Technology Co., LTD TETC Zhuhai, China

会议类型: 国际会议

会议名称: 2009 International Conference on Applied Superconductivity and Electromagnetic Devices(应用超导与电磁装置技术国际会议 ASEME 2009)

会议地点: 成都

会议语种:英文

页码: 131-132

在线出版日期: 2009-09-25（万方平台首次上网日期，不代表论文的发表时间）