CAE analysis of the big-size injection mold of rear bumper
The MPI/Cool analysis module is used to simulate and analyze the cooling system of the cars bumper. After improvement, a comparably reasonable cooling system is designed. The situation of curling and warping of the formed bumper parts is simulated and analyzed through the MPI/Warp analysis module, the cause of the excessive warpage in the formed parts is found out and relative solutions are put forward. The forming technology of injection mold is optimized and the problem of excessive warpage is resolved.
the cooling system warpage MPI/CooI MPI/Warp
Qingzhen Yin Ruikun Song Xiao Zhang Bin Qi
Qingdao University of Science and Technology, Qingdao, 266061, China
国际会议
2009 Advanced Polymer Processing(Qingdao)Intl Forum(2009高分子材料先进制造业(青岛)国际论坛
青岛
英文
375-380
2009-08-19（万方平台首次上网日期，不代表论文的发表时间）