FEM Analysis and Experimental Verification of the Ultrasonic Transducer for Thermosonic Flip-Chip Bonding Machine
The thermosonic flip-chip bonding technology operates in lower temperature, bonding force, and less bonding time than wire bonding. Improving the bonding efficiency of ultrasonic transducers plays an important role for bettering bonding process in gold-to-gold interfaces. Analysis of the transducer tool both in mechanical vibration and electrical performance is great concern. The commercial package GID & ATILA software is used for simulation first. Finding the best resonance frequency of the transducer tool was determined with LCR impedance meter experimentally. In this paper, we illustrate the in-laboratory thermosonic flip-chip bonding machine systematically and some characteristics of an ultrasonic transducer are investigated.
Yi-Cheng Huang Fu-Sheng Hsiao
National Changhua University of Education Dept. of Mechatronics Engineering No. 2, Shi-Da Road, Changhua City, TAIWAN
国际会议
2009 IEEE International Conference on Information and Automation(2009年 IEEE信息与自动化国际学术会议)
珠海、澳门
英文
773-777
2009-06-22（万方平台首次上网日期，不代表论文的发表时间）