A High Speed AOI Algorithm for Chip Component Based on Image Difference
In this paper, based on the images acquired from a 3-CCD color camera and a 3-color hemispherical circular illumination, a high speed algorithm is given to inspect the chip component. A statistical appearance modeling technique (SAM) is used to get the template which has preponderance than a rigid one. Before inspection, we use a high speed method to adjust the position of the component. Based on the difference image between component image and its template image, we use region differences to diagnose the defect. Finally, some experiment results are presented to show the validity of the algorithm. The common defects of missing component, insufficient solder, excessive solder, and open solder etc. can be identified properly by using the proposed algorithm. And the time spent on each component is less than 5ms.
Hongwei Xie Yongcong Kuang Xianmin Zhang
School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou,Guangdong Province, China
国际会议
2009 IEEE International Conference on Information and Automation(2009年 IEEE信息与自动化国际学术会议)
珠海、澳门
英文
969-974
2009-06-22（万方平台首次上网日期，不代表论文的发表时间）