An Ultrasonic System for Detecting Channel Defects in Flexible Packages

摘要：

Ultrasonic system was developed for detecting channel defects embedded in bonded 2-sheet flexible packages film. This hardware system consisted of spherically focused 22.66-MHz. Ultrasonic transducer, four-axis precision positioning system, NI PXI-bus embedded controller and ultrasonic pulser-receiver. The software system was designed based on the modularization, realized the echo signal on-line processing using ultrasonic Backscattered Echo Envelope Integral (BEEI) imaging method. Some experimental results were presented, and the BEEI mode imaging of channel defect was shown. The system can be easily used to detect the channel defects in flexible packages.

作者: Cunfu He Hongmei Yuan Bin Wu Guorong Song

作者单位: College of Mechanical Engineering & Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China

会议类型: 国际会议

会议名称: International Conference on Intelligent Computation Technology and Automation(2008 智能计算技术与自动化国际会议 ICICTA 2008)

会议地点: 长沙

会议语种:英文

页码: 974-977

在线出版日期: 2008-10-20（万方平台首次上网日期，不代表论文的发表时间）