Effect of the Content of Cu on Solderability and Mechanical Properties of Bi5Sb Solder Alloy

摘要：

It is difficult to develop the high temperature solder with the melting points within 250～ 450 ℃ in solder field. Bi5Sb solder alloy with the melting point of about 280℃ has bad solderability and mechanical properties. In the present work, the new BiSbCu ternary alloy was prepared by adding different contents of Cu to Bi5Sb solder alloy to improve its solderability and mechanical properties. Results showed that the effect of adding 0.5～5.0％Cu into Bi-5Sb on the melting point of Bi5Sb solder alloy was not distinct , but its solderability and mechanical properties were markedly improved. Compared to the matrix of Bi5Sb, the spreading area of solder alloy was about 57.8％ larger and the tensile strength was about 212.4％ higher when the content of Cu was 1.5wt.％. The microstructure showed that the needle-like Cu2Sb gradually became shorter and dense with the increasing of the content of Cu, which affected the properties of the solder alloy.

关键词： Bi5Sb Solder Alloy Cu Solderability Mechanical Properties

作者: Yanfu YAN Lifang FENG Xiaoxiao GUO Kun TANG Kexing SONG

作者单位: Material Science and Engineering College, Henan University of Science and Technology, Luoyang,Henan, Material Science and Engineering College, Henan University of Science and Technology, Luoyang,Henan,

会议类型: 国际会议

会议名称: 2008年中美材料国际研讨会

会议地点: 重庆

会议语种:英文

页码: 537-541

在线出版日期: 2008-06-09（万方平台首次上网日期，不代表论文的发表时间）