Study of High Efficient Discharge Cutting Solar Silicon and Tezturing Directly
Silicon solar cells are the most important branch of photovoltaic cells, and the silicon is the core component of solar cells. Solar wafer manufacturing process includes silicon cutting and surface texture forming, they are two independent processes in traditional silicon cell manufacturing process. A new technology dual-wire cutting and directly texturing on solar wafer is researched, which is based on composite dielectric liquid and using compound electric discharge machining (EDM) and electrochemical machining (ECM) technique. The results show that wire cut electric discharge machining with high travelling speed (HSWEDM)process on solar wafer has high efficiency, thin thickness, narrow cutting kerf and forming texturization on surface directly, as well as few or no surface microcracks and the reflectivity of texturization has a low reflection characteristic in full range spectrum. The integrative process of texturing and ECM/EDM combined cutting on solar wafer gives a potential way to shorten the fabrication processes of solar cell, reducing silicon cut costs and improving utilization of silicon, reducing the cost of manufacture significantly, and it provides a theoretical and practical basis of multi-wire HSWEDM and etching integration technology for solar-grade silicon machining, extend new fields for HSWEDM applications.
Solar wafer EDM ECM Cutting with synchronizing tezturing Composite dielectric liquid
Z. D. Liu M. B. Qiu W. Wang Z.J. Tian Y. H. Huang
College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
国际会议
The 16th International Symposium on Electromachining(第16届国际电加工会议)
上海
英文
47-51
2010-04-19（万方平台首次上网日期，不代表论文的发表时间）