Fundamental Study on High-quality Dicing Method for Semiconductor Package by Fiber Laser
Recently, the laser dicing method has been expected to replace a blade dicing method because of its high flexibility. However, in the laser dicing, the heat affected zone yielding heat damage should be reduced in order to prevent the deterioration of semiconductor devices consisting of silicon chip. Therefore, the reduction of heat affected zone was experimentally investigated by using cooled assist gas. It is clarified that the combination of nitrogen assist gas in the coaxial direction of laser beam and cooled assist gas from the rear side of cutting direction led to the better cutting results with low heat affected zone.
Semiconductor package Laser dicing High-quality Single-mode fiber laser Cooled assist gas Heat affected zone
Ryoji Kitada Yasuhiro Okamoto Yoshiyuki Uno Takuya Ikeda
Graduate School of Natural Science & Technology, Okayama University 3-1-1 Tsushimanaka, Kita-ku, Okayama 700 - 8530, Japan
国际会议
The 16th International Symposium on Electromachining(第16届国际电加工会议)
上海
英文
425-429
2010-04-19（万方平台首次上网日期，不代表论文的发表时间）