Assessing Influencing Factors of Residual Stresses in SLM Using a Novel Analysis Method
Selective Laser Melting (SLM) is a layered manufacturing process that allows to build complex, lightweight and customized parts by consolidating successive layers of powder. Since during the SLM process the powder material is completely molten, a low degree of porosity and good mechanical properties can be achieved. However, during the melting and solidification, the material experiences large temperature fluctuations in a short time. This causes high thermal stresses which can introduce part warpage, cracks or an unwanted decrease in strength of the parts. The goal of the reported investigation is to reduce the thermal stresses by changing standard parameters like the scan pattern or process parameters like the preheating temperature of the base plate, the layer thickness, pre-scanning a deposited powder layer or post-scanning an already scanned layer. To achieve this goal, a new method is defined which enables assessing thermal stresses in a fast way by measuring the curvature of test parts when releasing them from the base plate on which they are built. A review of the existing literature on this topic and the results of own experiments show that changes which lower high temperature gradients reduce the thermal stresses. Also changing the orientation of the scan vectors can reduce the thermal stresses, or can reduce the fatal consequences of the thermal stresses.
Rapid manufacturing Selective Laser Melting (SLM) Residual stresses
J.-P. Kruth J. Deckers E. Yasa R. Wauthle
Department of Mechanical Engineering, Catholic University of Leuven, Celestijnenlaan 300B BE-3001 Heverlee, Leuven, Belgium
国际会议
The 16th International Symposium on Electromachining(第16届国际电加工会议)
上海
英文
531-537
2010-04-19（万方平台首次上网日期，不代表论文的发表时间）