Ultrasonic Assisted Multi-Azial Wire Electrical Discharge Grinding (WEDG) Processes for Micro-EDM and Cylindrical-WEDM
Implementation of augmented spindles to Wire Electrical Discharge Machining (WEDM) and EDM Grinding (WEDG) processes with very thin wire are reported. On its analysis, the proposed analysis based upon WEDM discharge angle was introduced to clarify fundamental understanding of material removal mechanism. Cylindrical WEDM shaped contours were basically conjugated to the wires relative movement with respect to the revolution axis. The proposed analysis provided a better understanding for multiaxes WEDM, and also an useful strategy for improving both the stability and efficiency performance. On the other hand, conventional WEDG took a lot of machining time and resulted in rough surface on rod. An ultrasonic assisted WEDG system was then developed in this study; its significant effects on improving machining efficiency and surface integrity of workpiece were verified experimentally.
EDM Wire Electrical Discharge Grinding (WEDG) Cylindrical-WEDM Ultrasonic Assisted Machining (USM)
Albert W. -J. Hsue W. -C. Wei Yin Chuan
Department of Mechatronic Technology, Dahan Institute of Technology, Taiwan Mold & Precision Machining Technology Section, MIRDC Taiwan
国际会议
The 16th International Symposium on Electromachining(第16届国际电加工会议)
上海
英文
623-628
2010-04-19（万方平台首次上网日期，不代表论文的发表时间）