Thermal ezpansion and mechanical properties of high reinforcement content SiCp/Cu composites fabricated by squeeze casting technology

摘要：

High reinforcement content SiCp/Cu composites (ψp=50%, 55% and 60%) for electronic packaging applications were fabricated by patent cost-effective squeeze-casting technology. The composites appear to be free of pores, and the SiC particles are distribute uniformly in the composites. The mean linear coefficients of thermal expansion (CTEs, 20-100 ℃) of as-cast SiCp/Cu composites range from 8.8×10-6 ℃-1 to 9.9×10-6 ℃-1 and decrease with the increase of SiC content. The experimental CTEs of as-cast SiCp/Cu composites agree well with the predicted values based on Kerner model. The CTEs of composites reduce after annealing treatment due to the fact that the internal stress of the composite is released. The Brinell hardness increases from 272.3 to 313.2, and the modulus increases from 186 GPa to 210 GPa for the corresponding composites. The bending strength is larger than 374 MPa, but no obvious trend between bending strength and SiCp content is observed.

关键词： SiCp/Cu composites electronic packaging thermal ezpansion coefficient mechanical properties

作者: CHEN Guo-qin XIU Zi-yang MENG Song-he WU Gao-hui ZHU De-zhi

作者单位: School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China Center for Composite Materials, Harbin Institute of Technology, Harbin 150001, China School of Materials Science and Engineering,Harbin Institute of Technology, Harbin 150001, China

会议类型: 国际会议

会议名称: 2009 Frontier Symposium of China Postductors on Materrials Science(2009年中国博士后材料科学前言论坛)

会议地点: 长沙

会议语种:英文

页码: 600-604

在线出版日期: 2009-11-22（万方平台首次上网日期，不代表论文的发表时间）