Finte Element Analysis of PMMA Microfluidic Chip Based on Hot Embossing Technique
Using creep experiment to characterize the mechanical property of PMMA has been studied in this paper. Polynomial and first order exponential decay function have been used to fit the data to get creep curve of PMMA. With the finite element analysis method and based on the creep and viscoelastic material models, simulation of the hot embossing process is carried out. Time influence on hot embossing has been emphasized. The simulation result is proved by experiments. It is shown that simulation based on viscoelastic model represents more compliance with experiments, and can describe the process of polymer deformation during hot embossing.
Y Luo M Xu X D Wang C Liu
The Key Laboratory for Dalian University of Technology Precision & Nontraditional Machining of Minis The Key Laboratory for Micro/Nano Technology and System of Liao Ning Province, Dalian, China
国际会议
第四届仪器科学与技术国际会议( 4th International Symposium on Instrumentation and Science and Tcchnology)
哈尔滨
英文
1102-1106
2006-08-08（万方平台首次上网日期，不代表论文的发表时间）