Dimensional measurement of 3D microstruture based on white light interferometer
Dimensional metrology for micro/nano structure is crucial for addressing quality issues and understanding the performance of micro-fabricated products and micro-fabrication processes. Most of the established methods are based on optical microscopy for planar dimensions and stylus profilometry for out-of-plane dimensions. Contact profilers suffer from slow speed of measurement for three-dimensional profiles and are not suitable for delicate surfaces and parts. Advanced systems using white light interferometer are equipped with CCD cameras and interfaced with a microscope to conduct an array of measurements ranging from two-dimensional to threedimensional profiles and surface roughness analysis. This paper presents a methodology based on white light interferometer for the dimensional measurement of 3D micro-structures, demonstrated on micro-gears and moulds produced by UV lithography and vacuuM casting, respectively. Physical artifacts, such as gauge blocks, are also utilized to verify and validate the measurements on the microcomponents.
methodology microcomponents metrology surface roughness white light interferometer
S C H Thian W Feng Y S Wong J Y H Fuh H T Loh K H Tee Y Tang L Lu
Mechanical Engineering Department, National University of Singapore, 9 Engineering Drive 1,Singapore 117576
国际会议
第四届仪器科学与技术国际会议( 4th International Symposium on Instrumentation and Science and Tcchnology)
哈尔滨
英文
1435-1446
2006-08-08（万方平台首次上网日期，不代表论文的发表时间）