Effect of solder powder on the stability of solder paste

摘要：

In this study,effect of particle size distribution and oxygen content of solder powder on the stability of solder paste were in vestigated.Experiment results showed that,for the same particle size range,as the increase of solder powders D50,the stability of sold er paste became better. And for the same particle size distribution,the stability of solder paste also became better with the increase of solder powders oxygen content. The mechanism of granular solder paste formation was discussed.

关键词： solder powder solder paste stability

作者: CHEN Longchun ZHAO Zhaohui WANG Ruijie HU Qiang

作者单位: National Engineering and Technology Research Center for Non-Ferrous Metals Composites,General Resear Beijing COMPO Solder Co.Ltd.General Research Institute for Non-Ferrous Metals,Beijing 100088,China

会议类型: 国际会议

会议名称: The 10th China-Russia System on Advanced Materials and Technologies(第十届中俄新材料新工艺研讨会)

会议地点: 浙江嘉兴

会议语种:英文

页码: 414-417

在线出版日期: 2009-10-20（万方平台首次上网日期，不代表论文的发表时间）