Research on grain structure of super high purity copper sputtering target

摘要：

Influence of different deformation way and heat treating system on grain size of super high purity copper (>99.9999%) were researched in this paper.Results showed that the grain size of copper can be effectively refined by means of multi-direction forging and subsequent cold rolling,and then recrystallized at 300 t for 1.5 h,a fine and uniform grain size,preferably about 20μm or less,and a random distribution microstructure can be achieved,which can meet the requirement of sputtering target used for very large scale inte grated circuit.

关键词： super high purity copper grain size grain refinement integrated circuits

作者: LIU Shuqin JIA Songqing CHEN Ming

作者单位: General Research Institute for Non-ferrous Metals,Crikin Advanced Materials Co.,Ltd.Beijing 102200,China

会议类型: 国际会议

会议名称: The 10th China-Russia System on Advanced Materials and Technologies(第十届中俄新材料新工艺研讨会)

会议地点: 浙江嘉兴

会议语种:英文

页码: 460-463

在线出版日期: 2009-10-20（万方平台首次上网日期，不代表论文的发表时间）