Architecture Level Thermal Modeling for Multi-Core Systems using Subspace System Method

摘要：

This paper proposes a new architecture-level thermal modeling method to address the emerging thermal related analysis and optimization problem for high-performance multi-core microprocessor design. The new approach,called Thermsid,builds the thermal behavioral models from the measured or simulated thermal and power information at the architecture level. Thermsid builds the thermal models by first generating a IIankel matrix of Markov parameters,from which state matrices are obtained through minimum square optimization.Compared to existing behavioral thermal modeling algorithms,the proposed method is much more general as it does not require step temperature responses,leading to greater flexibility during the modeling process.Experimental results on a real quad-core microprocessor show that Therm sid provides accurate thermal behavioral models comparable existing approaches.

关键词： Thermal analysis architecture thermal modeling multicore processor

作者: Thom Jefferson A.Eguia Riujing Shen Sheldon X.-D.Tan Eduardo H.Pacheco Mudi Tirumala

作者单位: Department of Electrical Engineering University of California,Riverside,CA 92521,USA Intel Corporation,2200 Mission College Blvd,Santa Clara,CA 95052

会议类型: 国际会议

会议名称: 2009 IEEE 8th International Conference on ASIC(第八届IEEE国际专用集成电路大会)

会议地点: 长沙

会议语种:英文

页码: 714-717

在线出版日期: 2009-10-20（万方平台首次上网日期，不代表论文的发表时间）