A New Electrothermally-Aware Methodology for Full-Chip Temperature Optimization

摘要：

Due to the fact that there is electrothermal coupling between power,delay,and temperature,the paper presents a new electrothermally-aware methodology for full chip temperature optimization. The main idea is that characteristics of temperature distribution can be improved dramatically by a certain given delay penalty. As an example, based on HotSpot,the optimization for AMD Athlon 64 processor in 90-nm technology is given in the paper. Simulation results show that the chip temperature and power optimized by the proposed method are decreased,temperature gradient is also reduced.

关键词： Electrothermal coupling Temperature Full chip Optimization

作者: Gang Dong Peng Leng Changchun Chai Yintang Yang

作者单位: Microelectronics Institute,Xidian University,Xian 710071,China Xidian University,Xian 710071,China

会议类型: 国际会议

会议名称: 2009 IEEE 8th International Conference on ASIC(第八届IEEE国际专用集成电路大会)

会议地点: 长沙

会议语种:英文

页码: 1268-1271

在线出版日期: 2009-10-20（万方平台首次上网日期，不代表论文的发表时间）