Convez-cost Flow based Redundant-Via Insertion with Density-Balance Consideration

摘要：

As VLSI design complexity continues to increase,the yield loss due to via failure becomes more and more significant.Redundant via insertion is highly recommended for improving chip yield and reliability. In this paper,we study the redundant via insertion problem in a post routing stage,where a single via can have at most one redundant via inserted next to it. The goal is to insert as many redundant vias as possible and,at the same time,try to equilibrate the via density,which is good for the via density rules.We propose a convex-cost flow based approach to solve the problem within up to three routing layers. The experimental results show that,the proposed method can produce optimal solutions on defined density grid structure with maximum redundant via insertion,and achieve an at least 32.61% improvement of via density equalization.

关键词： DFM redundant via insertion via density density-balance

作者: Wei Guo Song Chen Mei-Fang Chiang Jian-Wei Shen Takeshi Yoshimura

作者单位: Graduate School of IPS,Waseda University,Kitakyushu,808-0135,Japan

会议类型: 国际会议

会议名称: 2009 IEEE 8th International Conference on ASIC(第八届IEEE国际专用集成电路大会)

会议地点: 长沙

会议语种:英文

页码: 1280-1283

在线出版日期: 2009-10-20（万方平台首次上网日期，不代表论文的发表时间）