REINFORCEMENT STUDY on PHOTOSENSITIVE RESIN’S TOUGHNESS WITH SiC WHISKERS
Stereolithography (SL) is the most widely used rapid prototyping technology and a key issue of the technology is in turn the development of molding material-photosensitive resins. Prepolymer of photosensitive resins-epoxy acrylate were synthesized with matching monoter-TMPTA and photoiniator-ITX, both selected according to SL craft demands for photosensitive resins and solidification mechanism of photosensitive resins. The mechanical behaviors of the developed photosensitive resins are not quite up to the requirements as expected, however. To overcome the existent shortcomings, an experiment was made to modify the material by reinforcing toughness with surface treated silane resin acceptor SiC whisker. A contrast between modified and unmodified materials in their micro structure, tensile strength and micro hardness shows a marked improvement in mechanical property of modified photosensitive resins.
Stereolithograghy photosensitive resins reinforcing photosensitive resins tenacity mechanical property
LIU Yongjiang WANG Ailing ZHU Limei WANG Biao
Key laboratory for AMT of Shanxi, North University of China, Taiyuan 030051, China
国际会议
International Technology and Innovation Conference 2009(2009技术与创新国际学术会议)
西安
英文
1-4
2009-10-12(万方平台首次上网日期,不代表论文的发表时间)