Recrystallization of the Copper Bottom Electrode during Complez Ozide Deposition onto Kapton Films

摘要：

In this work, we investigate for the first time the influence of complex oxide film deposition onto copper-coated polymer foils comprising a TiN seed layer on the microstructure of the underlaying randomly oriented copper film by means of wide-angle X-ray diffraction. Evidence of Cu crystallite size growth is given which is accompanied by an increase of Cu scattering crystalline volume. The final size of the copper crystallites depends on composition and microstructure of the ceramic oxide film.

作者: G. Suchaneck G. Gerlach Z. Hubicka A.A. Levin S. Günther M. Cada A. Dejneka L. Jastrabik D.C. Meyer E. Schultheiss

作者单位: TU Dresden,Solid Electronics Lab,01062 Dresden,Germany Institute of Physics of the ASCR,Division of Optics,Na Slovance 2,CZ-182 21 Praha 8,Czech Republic TU Dresden,Institute for Structural Physics,01062 Dresden,Germany Fraunhofer Institute for Electron Beam and Plasma Technology,interbergstraBe 28,01277 Dresden,German

会议类型: 国际会议

会议名称: 2009 The 18th IEEE International Symposium on Applications of Ferroelectrics(2009年国际铁电学暨IEEE国际铁电应用联合会议)

会议地点: 西安

会议语种:英文

页码: 305-309

在线出版日期: 2009-08-23（万方平台首次上网日期，不代表论文的发表时间）