Recrystallization of the Copper Bottom Electrode during Complez Ozide Deposition onto Kapton Films
In this work, we investigate for the first time the influence of complex oxide film deposition onto copper-coated polymer foils comprising a TiN seed layer on the microstructure of the underlaying randomly oriented copper film by means of wide-angle X-ray diffraction. Evidence of Cu crystallite size growth is given which is accompanied by an increase of Cu scattering crystalline volume. The final size of the copper crystallites depends on composition and microstructure of the ceramic oxide film.
G. Suchaneck G. Gerlach Z. Hubicka A.A. Levin S. Günther M. Cada A. Dejneka L. Jastrabik D.C. Meyer E. Schultheiss
TU Dresden,Solid Electronics Lab,01062 Dresden,Germany Institute of Physics of the ASCR,Division of Optics,Na Slovance 2,CZ-182 21 Praha 8,Czech Republic TU Dresden,Institute for Structural Physics,01062 Dresden,Germany Fraunhofer Institute for Electron Beam and Plasma Technology,interbergstraBe 28,01277 Dresden,German
国际会议
西安
英文
305-309
2009-08-23(万方平台首次上网日期,不代表论文的发表时间)