A Thermal-Driven Force-Directed Floorplanning Algorithm for 3D ICs1

摘要：

The three-dimensional (3D) integration circuit is a new technology with higher integration density. To solve the critical thermal issue in 3D layout, we propose a thermal-driven force-directed floorplanning algorithm. Based on the characteristic of the different stages of floorplanning, this algorithm applies different methods to calculate the thermal distribution to reach a tradeoff between time efficiency and accuracy. And a new effective strategy of the layer assignment is used in which we consider the area, the overlaps and the power densities simultaneously. Experimental results show that, compared with the recent thermal-driven force-directed 3D floorplanner, it averagely decreases the temperature by 8% and runtime by 10.7% while only increases the area and wirelength by 3% at most.

作者: Yun Huang Qiang Zhou Yici Cai Haixia Yan

作者单位: Tsinghua National Laboratory for Information Science and Technology Department of Computer Science and Technology Tsinghua University, Beijing 100084, China

会议类型: 国际会议

会议名称: 11th IEEE International Conference on Computer-Aided Design and Computer Graphics(第11届IEEE国际计算机辅助设计与图形学学术会议 IEEE CAD/GRAPHICS 2009)

会议地点: 黄山

会议语种:英文

页码: 497-502

在线出版日期: 2009-08-19（万方平台首次上网日期，不代表论文的发表时间）