Virtual Instrument Realization of Non-contact Silicon Wafer Test

摘要：

Based on virtual instrument technology,the paper conducts organic integration of capacitive displacement sensor ranging technology,eddy current sensor resistance testing technology and semiconductor P/N polarity of infrared pulse sensor testing technology,and develops dynamic non-contact silicon wafer testing instrument,which not only simulates the testing instruments like signal generator,digital oscilloscope,programmable power supply and digital multi-meter,but also has the functions like information fusion,data management,motion control and position detection. Dynamic non-contact test is the prior method of high speed and intelligent test of solar cell silicon wafers as well as the need of large-scale production of photovoltaic industry. Chinese Library Classification No.: TP206 Document code: A.

关键词： Non-contact test virtual instrument displacement sensor eddy current sensor

作者: YAN Youjun LI Yunfei

作者单位: Department of Electronic Information Engineering,Suzhou Vocational University,Suzhou,Jiangsu 215104 College of Computer Science and Technology,Suzhou University,Suzhou,Jiangsu 215002

会议类型: 国际会议

会议名称: 2009 9th International Conference on Electronic Measurement & Instruments(第九届电子测量与仪器国际会议 ICEMI2009)

会议地点: 北京

会议语种:英文

页码: 1003-1008

在线出版日期: 2009-08-16（万方平台首次上网日期，不代表论文的发表时间）