Full Working Condition Thermal Reliability Analysis for 3D-integrated Photo-mos SSR Package

摘要：

The temperature and thermal stress distribution are significant to investigate the thermal properties of micro-electronic devices. This paper illustrates the 3-D finite element thermal analysis on a photo-MOS sSR package (solid state relay) using software ANSYS9.0. Full working conditions including long conduction time, load changing and on and off shift are simulated using the built finite element computation model. The results indicate that large thermal stress intensively appears at the border of different layers and the corner of package. It suggests that material property and boundary condition are the main factors to determine the thermal stress distribution of the electronic photoMOS SSR packages. This achievements supplies theoretical foundation for the heat transfer and stress researches in other fields.

关键词： photo-mos SSR finite element analysis thermal stress pressure electro-thermal model.

作者: Dongmei Gao Haiwen Yuan Wenbing Li Haibin Yuan

作者单位: Department of Information Technologies,Beihang University,Beijing,100083,China Beijing Ketong Company of Electronic-relay,Beijing 100054

会议类型: 国际会议

会议名称: 2009 9th International Conference on Electronic Measurement & Instruments(第九届电子测量与仪器国际会议 ICEMI2009)

会议地点: 北京

会议语种:英文

页码: 3955-3958

在线出版日期: 2009-08-16（万方平台首次上网日期，不代表论文的发表时间）