Numerical Simulation of Flow and Heat Transfer over Louvered Fin Arrays for High Power Electronic Cooling
Three-dimensional (3-D) numerical simulation of airside thermal-hydraulic performance of louvered fin arrays was executed. Geometrical parameters of employed louvered fins are larger than those of previous studies and the Reynolds numbers of 2600-5300 based on louver pitches are also different. Several samples of louvered fin arrays with different louver angle (15°-29°), fin thicknesses (0.11.0mm), flow depths (160mm, 200mm, 240mm), and louver pitches (6mm,7mm,Smm) were used to analyze those air-side thermal-hydraulic performance in terms of heat transfer Colbum j factor and Fanning friction factor f. The integrated thermal-hydraulic performance was analyzed by dF index. Comparisons of computational results with correlations of small-size experiments were made. It seems to indicate heat transfer correlations for small-size louvered fins didnt pertain to large-size cases.
Louvered fin arrays Thermal-hydraulic performance Numerical simulation High power electronics
Jie Deng Nanyang Yu
School of Mechanical Engineering,Southwest Jiaotong University,Chengdu,China
国际会议
The 6th International Symposium on Heating,Ventilating and Air Conditioning(第六届国际暖通空调学术会议)
南京
英文
2047-2055
2009-11-06（万方平台首次上网日期，不代表论文的发表时间）