Failure Modes of Sn3.0Ag0.5Cu Flip-Chip Solder Joints under Current Stress
Electromigration in flip chip solder joints of Sn3.0AgO.SCu has been studied at current density of 2.03x104 A/cm2 and the bump temperature was at 120 C.Three potential failure modes were absolved and their corresponding microstructural mechanism was discussed in this paper.The pancake-type void is noticeable failure mode and dominated by current crowding.The continuous void at the cathode of contact interface between IMC and solder was also formed without current crowding.But the void has less area than the void at entire cathode contact interface to the Si Chip.The large area of IMC in left-hand section of solder joints distributed in solder joint uniquely.All of the unique microstructural evolution induced by electromigration concern the migration of atoms and vacancies in interconnects with unique geometry.
Sn3.0Ag0.SCu flip chip solder joint electromigration
Yu-Dong Lu Xiao-Qi He Yun-Fei En Xin Wang
Key Laboratory of Specially Functional Materials,College of Materials Science and Engineering,South National Key Laboratory for Reliability Physics and Its Application Technology of Electrical Compone National Key Laboratory forReliability Physics and Its Application Technology of Electrical Componen Key Laboratory of Specially Functional Materials,College of Materials Science and Engineering,South
国际会议
2009 8th International Conference on Reliability,Maintainability and Safety(第八届中国国际可靠性、维修性、安全性会议)
成都
英文
849-853
2009-08-24（万方平台首次上网日期，不代表论文的发表时间）