Reliability Assessment of Immersion Silver Finished Circuit Board Assemblies Using Clay Tests
This paper discusses issues regarding the reliability of immersion silver (ImAg) surface finish on printed circuit boards (PCBs) in high-sulfur environments with a focus on creep corrosion.The test approach used clay with sulfur to drive corrosion.It was found that silver sulfide had formed on the ImAg surfaces,but dendrite-shaped creep corrosion products were formed on the edges of the ImAg finished copper traces by galvanic corrosion.The creep distance and the content of CuS and Ag2S in the corrosion products were dependent on the relative location of the pad edges and the solder mask,which caused different extents of coverage of ImAg finish on the copper traces.A Weibull distribution with two parameters was used to analyze the length of the creep corrosion products, the values of which were used along with corrosion probability to assess the corrosion resistance of ImAg finished PCBs.
Immersion silver sulfur creep corrosion Weibull distribution
Yilin Zhou Michael Pecht
Research Lab of Electric Contacts,Automation School Beijing University of Posts and Telecommunicatio CALCE Electronic Products and Systems Center University of Maryland,College Park,20742,USA
国际会议
2009 8th International Conference on Reliability,Maintainability and Safety(第八届中国国际可靠性、维修性、安全性会议)
成都
英文
1212-1216
2009-08-24（万方平台首次上网日期，不代表论文的发表时间）