Research Progress on Constitutive Model of Solder Joints in Micro-electronic Packing

摘要：

The thermal-mechanical reliability of solder joints has been a key issue in the reliability assessment of electronic packaging.The recent developments in constitutive model of solder joints are summarized.Numerous constitutive models are proposed such as elastoplastic model,creep model,separated viscoplastic model,uniformed viscoplastic model and constitutive model based on fracture mechanics.At last,some suggestions for future investigations are also made.

关键词： Constitutive model solder joints electronic packaging viscoplastic

作者: Jiang Shao Chenhui Zeng Wenzheng Xu Kunlun Shan

作者单位: Aero Combined Environment Laboratory China Aero-Polytechnology Establishment Beijing,China

会议类型: 国际会议

会议名称: 2009 8th International Conference on Reliability,Maintainability and Safety(第八届中国国际可靠性、维修性、安全性会议)

会议地点: 成都

会议语种:英文

页码: 1248-1253

在线出版日期: 2009-08-24（万方平台首次上网日期，不代表论文的发表时间）