Failure Analysis and Precaution of Plastic Encapsulated Microcircuits

摘要：

The paper introduces the common failure mechanisms and their effect on the Plastic Encapsulated Microcircuits (PEMs).During the reflow soldering procedure,delamination between plastic mold compound/die or plastic mold compound/ lead frame interface occurs frequently.Delamination is the channel for vapour to inbreak into the PEMs and affects its reliability.In this paper, the author analyses the failure mechanism of delamination and provides two typical failure analysis cases to explain it The micro-processor failed because the pop-corn effect leads to delamination between its plastic mold compound/lead frame interface.The SRAM failed because the thermal-expansion coefficient mismatch of the plastic mold compound and the die.In the end,some precautions fur reducing such failures are presented.

关键词： plastic encapsulated microcircuits (PEMs) reliability delamination failure analysis coefficient thermal ezpansion (CTE)

作者: LIN Xiao-ling YAO Ruo-he KONG Xue-dong ZHANG Xiao-wen

作者单位: Institute of Microelectronics,School of Electron and Information Engineering,South China University China Electronic Product Reliability and Environmental Testing Research Institute Guangzhou,510640,C

会议类型: 国际会议

会议名称: 2009 8th International Conference on Reliability,Maintainability and Safety(第八届中国国际可靠性、维修性、安全性会议)

会议地点: 成都

会议语种:英文

页码: 1254-1257

在线出版日期: 2009-08-24（万方平台首次上网日期，不代表论文的发表时间）