Burn-in Method Study of Surface Mounted Plastic Encapsulated Devices and Board-level Verification

摘要：

Industry-level plastic encapsulated devices have been used gradually in high reliability field.The screening and qualification procedures of packagelevel and board-level are necessary for high reliability,in which burn-in is a key part In this paper,board-level test was carried out based on implantable brain simulator circuits of our lab.A burn-in method for surface mounted plastic encapsulated devices is presented in this paper, and the junction temperature control is based on case temperature control and equivalent thermal resistance value between case and junction,board-level test was carried out after package-level devices burn-in for avoiding devices potential invalidation caused by unsuitable stress during burn-in.

关键词： package-level burn-in surface mounted plastic encapsulated devices board-level verification.

作者: Weiming Wang Hongwei Hao Bozhi Ma Yuan Yuan Luming Li

作者单位: Tsinghua Space Center,Tsinghua University Beijing,China

会议类型: 国际会议

会议名称: 2009 8th International Conference on Reliability,Maintainability and Safety(第八届中国国际可靠性、维修性、安全性会议)

会议地点: 成都

会议语种:英文

页码: 1330-1332

在线出版日期: 2009-08-24（万方平台首次上网日期，不代表论文的发表时间）