New Packaging Technology Enabling Integration of Magnetics and Semiconductors in One Component
The continuous trend towards convergence and miniaturization is recently generating significant interest in new technologies for Electronics. This requires the integration of Semiconductors and Magnetics, two entirely different industries with different players in the value chain. In this paper, we demonstrate a packaging technology which allows three dimensional stacking of Magnets and Semiconductors. We realized the integration of a Semiconductor chip -which provides protection against electro static discharge (ESD)-and a common mode filter (CMF) into one thermoplastic package. For the first time ever, this filter is integrated directly into the thermoplastic part which is used as the substrate, filter and housing at the same time. Laser direct structuring in combination with Stanyl?ForTiiTM as an ultra high performance, entirely halogen-free high temperature thermoplastic omits any wires for the realized coil, and also facilitates high flexibility in design and manufacturing, allowing ultra small footprints and the realization of components suitable for surface mount technology. As an example of this new technology, we demonstrate a component which can provide full ESD protection and common mode filtering for a high speed USB2.0 interface.
Abel Pot Horst Roehm Rinus v.d. Berg Tamim P. Sidiki
DSM Engineering Plastics, Geleen, The Netherlands DSM Engineering Plastics, Global Research & Techno NXP Semiconductors, Hamburg, Germany DSM Engineering Plastics, Global Research & TechnologyUrmonderb DSM Engineering Plastics, Sittard, The Netherlands DSM Engineering Plastics, Global Research & Techn
国际会议
北京
英文
18-22
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）