Packaging and Assembly of 12-Channel Parallel Optical Transceiver Module

摘要：

The fabrication process of a 12-channel parallel optical transceiver module developed in our group is presented in this paper. The module is composed of a VCSEL array, a PIN PD array, a VCSEL driver chip, a TIA/LA chip and supporting PCB and connector. A SiOB and its vertical assembly are emphasized as the highlights of the structure of this module, which is promising to effectively reduce the package cost and improve the optical coupling efficiency.

作者: Zhihua Li Wei Gao Jian Song Baoxia Li Lixi Wan

作者单位: Institute of Microelectronics, Chinese Academy of Sciences3＃ BEITUCHENG West, CHAOYANG District, Bei Institute of Microelectronics, Chinese Academy of Sciences 3＃ BEITUCHENG West, CHAOYANG District, Be

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 28-30

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）