Artificial Neural Network Application in Vertical Interconnection Modeling

摘要：

This paper proposes a neural network-based method for modeling vertical interconnect balls. The π equivalent circuit with lumped element was used to characterize the electrical performance of balls. The values of lumped elements were extracted from the full-wave simulate result, and the extracted data was used to train back-propagation (BP) neural networks to obtain the relationship between the lumped element values and the physical size of the balls. Then this model was used to estimate the electrical character of ball with other layout parameters.

作者: Yuanjun Liang Lei Li

作者单位: Shenzhen Institute of Advanced Integration TechnologyChinese Academy of Sciences/The Chinese Univers Shenzhen Institute of Advanced Integration Technology Chinese Academy of Sciences/The Chinese Univer

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 56-59

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）