Thermal Analysis and Testing of Multi Layer Ceramic-Metal Packaged LED

摘要：

We studied the thermal properties LED light unit composed of nine LED chips in a MLCMP (multi-layer ceramic-metal package) and compared various thermal dynamic models. We concluded that the direct measurement of forward voltage Vf is the most practical approach for in-situ testing. By calibrating the Vf to junction temperature Tj at various forward current in a temperature controlled oven, the linear relationship of Vf with respect to Tj was obtained and coefficient β was accurately extracted from experimental data.

作者: Peng Jin Qifeng Zhou Na Wu Qun Zhong

作者单位: The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University,Shenzhe The Key Laboratory of Integrated Microsystems, Shenzhen Graduate School of Peking University, Shenzh

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 157-159

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）