Finite Element Thermal Analysis for High Power Multi-chip Light Emitting Diode
In this paper, finite element method (FEM) numerical thermal simulation is performed on the given packaging configuration, and temperature as well as heat flux distribution are obtained. An optimal packaging configuration is obtained by simulating different materials and structures of the heat sink, submount, die attach, different die arrangement styles and die spacing parameters. A reasonable simplification for the high power multi-chip light emitting diode packaging body is performed and a precise FE model is established, and then a high-quality meshing is carried out. A comprehensive simulation is performed to get the temperature distribution of the chip for different materials and structure parameters of certain components; the mechanism of the change of the temperature is analyzed. Simulation results show that an ideal temperature for chip junction under standard input power on the normal working conditions can be obtained through appropriate selection of heat sink structure and material, sub-mount material and structure parameter, die attach material and structure parameter, die arrangement style and spacing parameter.
Longzao Zhou Hongtao Chen Bing An Fengshun Wu Yiping Wu
Wuhan National Laboratory for OptoelectronicsState Key Laboratory of Material Processing and Die & M Wuhan National Laboratory for Optoelectronics State Key Laboratory of Material Processing and Die &
国际会议
北京
英文
164-168
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）