Modeling of Manufacturing Processes of High Power Light Emitting Diodes: Wire Bonding Process

摘要：

In this paper, the wire bonding process of high power light emitting diodes (LED), which was simplified to consist of impact and vibration stages, was investigated by using a nonlinear finite element method. Parametric studies were carried out to examine the effects of the ultrasonic vibration amplitude, the friction coefficient between the free air ball (FAB) and bond pad, the incline of LED chip on stress and strain distribution in the bond pad and ohmic contact layer of both p-type and n-type electrode structure. This numerical simulation work may provide guidelines for the wire bonding process virtual window development of high power lighting emitting diodes package.

作者: Zhaohui Chen Yong Liu Sheng Liu

作者单位: Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, Shanghai, P. Wuhan National Laboratory for OptoelectronicsHuazhong University of Science & Technology, Wuhan, P. Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University, Shanghai, P.

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 187-192

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）