Moire Method for Nanoprecision Wafer-to-Wafer Alignment: Theory, Simulation and Application

摘要：

The two dimensional (2D) moiré centrosymmetric grating is developed to assist realization of high-precision wafer-towafer alignment and non-destructive measurement of misalignments for wafer bonding. Using these moiré patterns the misalignments in the order of ± 64 nm in X-Y axis can be resolved by a simple IR microscopy (5×objective) images. This value can be further improved to sub-10 nm range if the sub-pixel estimation is performed. For current status, the limit of the minimum resolved misalignment using moiré gratings is～0.2 nm according to theoretical analysis. It can be applied for not only the future 3D integration of wafer-scale, but also the fabrication of 3D nanostructures and advanced lithography techniques.

作者: Chenxi Wang Tadatomo Suga

作者单位: School of Engineering, the University of Tokyo7-3-1 Hongo, Bunkyo-ku, Tokyo, 113-8656, Japan School of Engineering, the University of Tokyo 7-3-1 Hongo, Bunkyo-ku, Tokyo, 113-8656, Japan

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 219-224

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）