Localized Induction Heating for Wafer Level Packaging

摘要：

Localized induction heating for wafer level packaging is discussed. This paper is to investigate the relationships between the geometry of solder loop and temperature distribution in induction heating. Using finite element method (FEM) and IR thermal imager, temperature distribution and variation are explored, which shows that the temperature on the solder loops is a function of the area and edge width in the induction heating. The temperature difference between the solder loop and its center on PCB is about 180℃, which shows an obvious localized heating effect. Thermal images of circle and square solder array indicate uniform temperature distribution on the PCB in the induction heating. Good agreement between measured and simulated temperature variation have been achieved.

作者: Mingxiang Chen Wenming Liu Yanyan Xi Changyong Lin Sheng Liu

作者单位: Division of MOEMS, Wuhan National Laboratory for Optoelectronics, Wuhan, China, 430074 Institute of Microsystems, School of Mechanical Engineering, HUST, Wuhan, China, 430074

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 225-229

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）