Thermal Design of Power Module to Minimize Peak Transient Temperature
This paper investigates the impact of the geometry of the heat spreader and the heat transfer coefficient of the heat exchanger on the steady-state and transient thermal performances of power semiconductor modules. Results show that the steady-state thermal resistances along the thermal flow path change with heat transfer coefficients owing to limited heat spreading effect. The transient thermal performance is mainly affected by the thermal capacitance in the power module. To minimize the transient thermal impedance without sacrificing weight, cost, and so on, the thickness of the heat-spreader should be selected to match the thermal time constant to the transient duration. Based on these results, a methodology is proposed to conservatively select the thickness of the heat spreader to maintain the silicon junction at a required peak transient temperature. The methodology is exemplified and verified by a thermal design for a mediumvoltage power module.
Xiao Cao Khai D. T. Ngo Guo-Quan Lu
The Bradley Department of Electrical and Computer EngineeringVirginia Polytechnic Institute and Stat The Bradley Department of Electrical and Computer Engineering Virginia Polytechnic Institute and Sta
国际会议
北京
英文
248-254
2009-08-10（万方平台首次上网日期，不代表论文的发表时间）